| 发明名称 |
Single unit automated assembly of flex enhanced ball grid array packages |
| 摘要 |
A package is provided for the mounting of IC devices. The IC die is bonded to metal traces contained in a flexible tape, the IC die with the flexible tape is attached to a stiffener (heat spreader), the various heat conducting interfaces are cured and solder balls are attached to another surface of the flexible tape.
|
| 申请公布号 |
US6759752(B2) |
申请公布日期 |
2004.07.06 |
| 申请号 |
US20030371515 |
申请日期 |
2003.02.20 |
| 申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
CAMENFORTE RAYMUNDO M.;BRIAR JOHN |
| 分类号 |
H01L23/36;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
