发明名称 |
Wire bonding to dual metal covered pad surfaces |
摘要 |
Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.
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申请公布号 |
US6759597(B1) |
申请公布日期 |
2004.07.06 |
申请号 |
US19980017338 |
申请日期 |
1998.02.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CUTTING LAWRENCE RICHARD;GAUDIELLO JOHN GERARD;MATIENZO LUIS JESUS;MURDESHWAR NIKHIL MOHAN |
分类号 |
H01L21/60;H01L21/607;H01L23/498;H05K3/24;H05K3/32;(IPC1-7):H05K1/16 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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