发明名称 Positive-working resist composition
摘要 Provided is a chemical-amplification positive-working resist composition capable of giving a resist pattern having excellent dry etching resistance and adhesion to the substrate with high pattern resolution and further having a good profile with improvement in the line edge roughness. It is a chemical-amplification positive-working resist composition by using, as the component (A) in a positive-working resist composition comprising (A) a resinous ingredient capable of being imparted with increased solubility in an alkaline aqueous solution by the interaction of an acid, (B) an acid-generating agent ingredient generating an acid by irradiation with a radiation and (C) an organic solvent, a copolymer of which the monomer units constituting the main chain consist of acrylic acid ester or methacrylic acid ester units having solubility-reducing groups, monomer units derived from an ester of acrylic acid or methacrylic acid and a lactone ring-containing bridged saturated polycyclic alcohol and monomer units derived from an ester of acrylic acid or methacrylic acid and a straight-chain alcohol substituted by hydroxyl group, alkoxy group or acyl group.
申请公布号 US6759176(B2) 申请公布日期 2004.07.06
申请号 US20010993627 申请日期 2001.11.27
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 IWAI TAKESHI;HADA HIDEO;FUJIMURA SATOSHI
分类号 C08F220/26;C08K5/00;C08K5/17;C08L101/00;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 C08F220/26
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