发明名称 |
Positive-working resist composition |
摘要 |
Provided is a chemical-amplification positive-working resist composition capable of giving a resist pattern having excellent dry etching resistance and adhesion to the substrate with high pattern resolution and further having a good profile with improvement in the line edge roughness. It is a chemical-amplification positive-working resist composition by using, as the component (A) in a positive-working resist composition comprising (A) a resinous ingredient capable of being imparted with increased solubility in an alkaline aqueous solution by the interaction of an acid, (B) an acid-generating agent ingredient generating an acid by irradiation with a radiation and (C) an organic solvent, a copolymer of which the monomer units constituting the main chain consist of acrylic acid ester or methacrylic acid ester units having solubility-reducing groups, monomer units derived from an ester of acrylic acid or methacrylic acid and a lactone ring-containing bridged saturated polycyclic alcohol and monomer units derived from an ester of acrylic acid or methacrylic acid and a straight-chain alcohol substituted by hydroxyl group, alkoxy group or acyl group.
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申请公布号 |
US6759176(B2) |
申请公布日期 |
2004.07.06 |
申请号 |
US20010993627 |
申请日期 |
2001.11.27 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
IWAI TAKESHI;HADA HIDEO;FUJIMURA SATOSHI |
分类号 |
C08F220/26;C08K5/00;C08K5/17;C08L101/00;G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 |
主分类号 |
C08F220/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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