| 摘要 |
PURPOSE: Provided is a resin composition for sealing semiconductor devices, which has low stress, high heat resistance and strength and excellent break resistance to improve the cracking resistance of a semiconductor package. CONSTITUTION: The resin composition is prepared by the method comprising the steps of: (1) providing semi-spherical silica by milling fused prismatic silica; (2) treating the semi-spherical silica with water or alcohol containing a coupling agent: and (3) mixing 80-90 wt% of the silica comprising the silica obtained from steps (1) and (2) and spherical silica, 5-12 wt% of at least one selected from the group consisting of ortho-cresol novolac epoxy resin having an equivalent of 190-250, a viscosity of 0.5-4.0 and a chloride ion content of 500 ppm or less, epoxy resins of formula II, III and IV and mixtures thereof, 3-6 wt% of a phenol resin curing agent selected from the group consisting of a phenol novolac resin having a hydroxyl equivalent of 100-150 and a viscosity of 1-4 poise, naphthalene-based or xylene-containing phenol resin having an equivalent of 150-230 and a viscosity of 0.5-30 poise and mixtures thereof, and conventional additives. In formula II, R1 is H or CH3 and R2 is a C0-20 alkyl. In formulae III and IV, each n is an integer of 0-5 and each R is H or a C1-C18 alkyl.
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