| 摘要 |
<p>PURPOSE: A semiconductor device and a method for manufacturing the same are provided to be capable of preventing peeling or lifting of a metal pad due to pull-up test in wire bonding. CONSTITUTION: A metal interconnection(51) is formed on a substrate(50). An insulating layer(52) is formed on the metal interconnection. A plurality of via contacts(53a-53e) are connected to the metal interconnection through the insulating layer. A metal pad(54) is formed on the via contacts. Each width of the via contacts becomes narrower from the edge portion to the center portion.</p> |
