发明名称 Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages
摘要 A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide core power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors. In one embodiment, the power laminate may include a plurality of apertures which allow for the passing of connections between the integrated circuit and the PCB. The integrated circuit may be mounted to the PCB by solder balls of a ball-grid array, elestomeric connections of a land-grid array, or other type of mounting. The each of the solder balls or elastomeric connections may pass though one of the apertures of the power laminate.
申请公布号 US6760232(B2) 申请公布日期 2004.07.06
申请号 US20010809838 申请日期 2001.03.16
申请人 SUN MICROSYSTEMS, INC. 发明人 SMITH LARRY D.;FREDA MICHAEL C.;HASSANZADEH ALI
分类号 H05K1/02;H05K1/14;H05K3/34;H05K3/36;H05K7/10;(IPC1-7):H05K7/02;H05K7/06;H05K7/08 主分类号 H05K1/02
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