发明名称 |
Method for surface mounted power transistor with heat sink |
摘要 |
A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate of the heat sink is provided with a plurality of openings through which the solder of the solder pad flows during the solder reflow process so that the mounting plate is securely adhered between the power transistor and the circuit board. The mounting plate of the heat sink is connected thermally to an extension member which extends generally perpendicular to the mounting plate, the extension member in turn being connected to a heat dissipation surface which may be one or several fins.
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申请公布号 |
US6759278(B2) |
申请公布日期 |
2004.07.06 |
申请号 |
US20020108885 |
申请日期 |
2002.03.28 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ASHDOWN GLYNN RUSSELL |
分类号 |
H01L23/367;(IPC1-7):H01L21/44;H01L21/48 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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