Online tension monitor system for robot x-belt of mirra CMP

摘要

A method and system for monitoring tension associated with a robot-controlled belt utilized in a semiconductor wafer polishing apparatus. A belt tension monitor can be adapted for use with the semiconductor wafer polishing apparatus to detect a variable tension of the robot-controlled belt. An upper tension limit and a lower tension limit of the robot-controlled belt may then be monitored utilizing the belt tension monitor to prevent a breakage of the robot-controlled belt during a semiconductor wafer polishing operation thereby extending a life of the robot-controlled belt. The belt tension monitor can be installed at an inertial pulley of a robot associated with the semiconductor wafer polishing apparatus to detect the variable tension of the robot-controlled belt.