| 摘要 |
A hybrid coupler (10, 90, 110, 130, 160, 210) includes a substrate (12) having a coupling structure formed thereon using thick film processing techniques. The coupling structure includes two parallel conductive strips (21, 31). One strip (21) is coupled at one end to an incident port (22) and at the other end to a direct port (23). The other strip (31) is coupled at one end to a coupled port (32) and at the other end to an isolated port (33). An electrically conductive shield (71, 91, 111, 164) is aligned with and enhances coupling between the conductive strips. A dielectric layer (61, 162) is provided between the shield and the conductive strips.
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