METHOD FOR PACKAGING MULTICHIP MODULE FOR SEMICONDUCTOR

摘要

PURPOSE: A method for packaging a multichip module for a semiconductor is provided to embody a chip scale package of a surface-mounting package module by using circuit-patterned tape on an anisotropical conductive adhesive tape, and to radiate the heat of a chip to the outside by using thermal conductive adhesive. CONSTITUTION: After adhesive is applied to tape(110) on which a circuit is patterned, the connection terminals of the tape is connected and attached to a bonding pad of a chip(130). After adhesive is applied to the upper surface of the chip, the tape is folded to be attached to the upper surface of the chip. A plurality of ball terminals are formed on the lower surface of the tape to be electrically connected to the connection terminals of the tape. An individual chip scale package fabricating process including the aforementioned processes is reiterated to fabricating the individual chip scale package as much as desired. Another individual chip scale package is stacked on an arbitrary individual chip scale package wherein the ball terminal of the upper individual chip scale package is attached to the patterned circuit of the tape covering the lower individual chip scale package and is electrically conducted so that the stack process is repeated as many times as desired.