CMP APPARATUS WITH SPRAY NOZZLE OF ULTRA PURE WATER FOR REMOVING SLURRY

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to prevent the generation of particles by removing slurry on a wafer using a spray nozzle of ultra pure water. CONSTITUTION: A CMP apparatus includes a pusher(30) for transporting a wafer to a rotary transporter(40). The CMP apparatus further includes a spray nozzle(50) of ultra pure water. By spraying the ultra pure water to the wafer using the spray nozzle, slurry on the wafer is removed. The spray nozzle of the ultra pure water is provided with a plurality of spray holes(52a).