发明名称 |
Method for forming wiring structure |
摘要 |
After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the wiring grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the wiring are removed by polishing. Thereafter, a foreign matter adhered to a surface to be polished during polishing is removed and then a surface of the anti-reflection film is polished.
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申请公布号 |
US6759322(B2) |
申请公布日期 |
2004.07.06 |
申请号 |
US20020328171 |
申请日期 |
2002.12.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YOSHIDA HIDEAKI;UEDA TETSUYA;HAMANAKA MASASHI;HARADA TAKESHI |
分类号 |
H01L21/02;H01L21/3105;H01L21/311;H01L21/321;H01L21/768;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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