Semiconductor device and manufacturing method thereof

摘要

A type of semiconductor device and its manufacturing method, which can further miniaturize semiconductor devices and reduce design restrictions by minimizing the fillet around the semiconductor chip. The semiconductor package is constituted by fixing semiconductor chip 100 on insulating substrate 102 via die paste 104. Semiconductor chip 100 has top surface 112, where an electronic circuit is formed, and a bottom surface 114 adhered to insulating substrate 102. The bottom surface 114 is formed smaller than top surface 112. By forming bottom surface 114 smaller than top surface 112, the amount of the fillet spread out around semiconductor chip 100 can be reduced.