发明名称 II-VI semiconductor device with BeTe buffer layer
摘要 A II-VI semiconductor device includes a stack of II-VI semiconductor layers electrically connected to a top electrical contact. A GaAs substrate is provided which supports the stack of II-VI semiconductor layers and is positioned opposite to the top electrical contacts. A BeTe buffer layer is provided between the GaAs substrate and the stack of II-VI semiconductor layers. The BeTe buffer layer reduces stacking fault defects at the interface between the GaAs substrate and the stack of II-VI semiconductor layers.
申请公布号 US6759690(B2) 申请公布日期 2004.07.06
申请号 US20030408407 申请日期 2003.04.07
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 MILLER THOMAS J.
分类号 H01L21/36;H01L33/00;H01L33/28;H01S5/347;(IPC1-7):H01L33/00 主分类号 H01L21/36
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