METHOD FOR MOUNTING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for mounting a semiconductor package is provided to simplify a mounting process and utilize effectively the bar code information by forming a reflow unit and a labeling unit with one body. CONSTITUTION: A method for mounting a semiconductor package includes a reflow process and a labeling process. The reflow process is performed to load a semiconductor package on a printed circuit board by using a reflow unit. The reflow unit and a labeling unit are formed with one body. The labeling process is performed to adhere a label on one side of the semiconductor package after the reflow process is finished. The labeling process is to print data of a printing film on a labeling film by using a heat transfer printing method.