WIRE-STACKED SEMICONDUCTOR PACKAGE AND ITS STRUCTURE

摘要

PURPOSE: A wire-stacked semiconductor package is provided to facilitate a re-work when at least two semiconductor chips are packaged even if a defect occurs in one of chips of the semiconductor package by additionally forming out-wires on the upper and lower surfaces of a package such that the out-wires are vertically connected to a leadframe in each package and the end of the out-wire is of a latch type and by interconnecting the out-wires of different semiconductor packages. CONSTITUTION: A leadframe is vertically connected to the upper and lower surfaces of the semiconductor package to form a plurality of out-wires(220) protruding to the outside of the package wherein the end of the out-wire is of a latch type. A support unit(230) of a predetermined height is formed on the outside of the package having the out-wire.