APPARATUS AND METHOD FOR ALIGNING WAFER

摘要

PURPOSE: An apparatus and a method for aligning a wafer are provided to obtain a desired orient angle to locate a wafer at a desired position by rotating a wafer chuck, twice. CONSTITUTION: An apparatus for aligning a wafer includes a wafer chuck, a light emission part, a light receiving part, a compensator, and a controller. The wafer chuck(100) is used for loading and rotating a wafer. The light emission part(102) is used for irradiating the light on an edge of the wafer. The light receiving part(104) is used for receiving the light from the edge of the wafer and outputting an electric signal. The compensator(106) is used for compensating the electric signal of the light receiving part to sense a wafer flat zone. The controller(112) is used for sensing the wafer flat zone according to the compensated electric signal and calculating a rotating angle of a wafer chuck to rotate the wafer chuck to the desired position.