发明名称 WAFER CLEANING APPARATUS
摘要 PURPOSE: A wafer cleaning apparatus is provided to remove effectively particles from a wafer by eroding the wafer using a predetermined voltage between a working electrode and a counter electrode. CONSTITUTION: A cleaning bath(100) stores chemical solutions. A wafer(120) is in the cleaning bath. A working electrode(110) is formed at an edge of the wafer. A reference electrode(115) is formed at the edge of the wafer near to the working electrode. A counter electrode(130) is installed opposite the working electrode in the cleaning bath. A measurement part(150) for measuring a reference voltage between the working electrode and the reference electrode is connected with the working electrode and the reference electrode. A power supply(140) is used for supplying a predetermined voltage to the wafer by using the working electrode and the counter electrode. The predetermined voltage is smaller than the reference voltage.
申请公布号 KR20040059468(A) 申请公布日期 2004.07.05
申请号 KR20020086216 申请日期 2002.12.30
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 SEO, BO MIN
分类号 H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/302
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