发明名称 |
WAFER CLEANING APPARATUS |
摘要 |
PURPOSE: A wafer cleaning apparatus is provided to remove effectively particles from a wafer by eroding the wafer using a predetermined voltage between a working electrode and a counter electrode. CONSTITUTION: A cleaning bath(100) stores chemical solutions. A wafer(120) is in the cleaning bath. A working electrode(110) is formed at an edge of the wafer. A reference electrode(115) is formed at the edge of the wafer near to the working electrode. A counter electrode(130) is installed opposite the working electrode in the cleaning bath. A measurement part(150) for measuring a reference voltage between the working electrode and the reference electrode is connected with the working electrode and the reference electrode. A power supply(140) is used for supplying a predetermined voltage to the wafer by using the working electrode and the counter electrode. The predetermined voltage is smaller than the reference voltage.
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申请公布号 |
KR20040059468(A) |
申请公布日期 |
2004.07.05 |
申请号 |
KR20020086216 |
申请日期 |
2002.12.30 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
SEO, BO MIN |
分类号 |
H01L21/302;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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