METHOD AND APPARATUS FOR POLISHING SILICON WAFER

摘要

PURPOSE: A method and an apparatus for polishing a silicon wafer are provided to prevent various external contaminants by removing positive electric charges from a surface of a silicon wafer after polishing the silicon wafer. CONSTITUTION: A silicon wafer is mounted on an adhesive plate, which is installed on a polishing head of a polishing apparatus(S1). A polishing process is performed on a surface of the silicon wafer by using a polishing slurry after the silicon wafer is closed to the polishing pad(S2). A polishing side of the silicon wafer is separated from the polishing pad and a surfactant is injected into the polishing side of the silicon wafer(S3).