ASSEMBLING METHOD OF THERMOELECTRIC CONVERSION MODULE

摘要

PROBLEM TO BE SOLVED: To provide an assembling method of a thermoelectric conversion module using a bonding step in which a semiconductor may be bonded in a low temperature not to deteriorate a semiconductor device (thermoelectric conversion material) and a fusing point of a bonded portion resulting from bonding becomes a temperature in a high temperature zone.

SOLUTION: In the assembling method of the thermoelectric conversion module having the step of using wax 13 to bond an electrode member 12 to a semiconductor chip 11, low fusing point Au-Sn wax 13 is interposed between the bonding surface of the electrode member 12 and the bonding surface of the semiconductor chip 11 and in such a state, a bonding position where the wax 13 is interposed is heated to a temperature higher than a solidus temperature of the wax 13 for 150°C to 430°C to incur liquidus diffusion between the wax 13 and the electrode member 12, thereby bonding the electrode member 12 and the semiconductor chip 11.

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