| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a press-fitted/fixed semiconductor module in which the bending stress of a semiconductor chip at the time of press-fitting/engagement is reduced and a module can be miniaturized, and to provide a fixing method of the press-fitted/fixed semiconductor module device. <P>SOLUTION: An electrode body 3 of the press-fitted/fixed semiconductor module 1 has a projection part 33, and the projection part 33 is press-fitted to and engaged with a through hole 90 of a conductive plate 9. The electrode body 3 is mechanically fixed and electrically connected to the conductive plate 9. Heat of the semiconductor chip 2 is radiated to the conductive plate 9 through the electrode body 3. Thus, press-fitting and engagement can firmly be performed without giving bending stress to the semiconductor chip 2 and bonding layers 5 and 6 with formation of the projection part 33. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
