| 摘要 |
PROBLEM TO BE SOLVED: To enhance effectiveness of transporting by making the occupancy of a device small in an insulating film forming device, in which an insulating film is formed on a substrate, for example on a wafer. SOLUTION: An insulating film forming device is composed of a first treatment tower T1 and a second treatment tower T2, constituted by mutually laminating a coating unit 26 for coating a coating liquid on a wafer including an insulating film forming material, a temperature-regulating unit 25 for regulating the wafer to a specified temperature before being coated with the coating liquid, and a baking unit 28 for heating the wafer coated with the coating liquid, and the wafer is transferred to each processing unit of the treatment towers T1 and T2 by a substrate transfer means 24. The wafer is sequentially subjected to a series of processings by a plurality of processing units of each processing tower T1 and T2, whereby the insulating film is formed on the wafer. In this way, since the processing unit is thus collected, the fractional occupancy of the device is made small, effectiveness of transfer is enhanced. COPYRIGHT: (C)2004,JPO&NCIPI
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