发明名称 METHOD FOR MANUFACTURING COVER BODY OF PACKAGE FOR ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the usage of wax materials, and to form a wax material layer in a desired shape at a cover body. SOLUTION: A band-shaped cover member 30 is prepared, and a guide hole 30a is perforated by continuous press working. Then, the cover member 30 is operated with Ni plating 31, and then operated with Au plating 32 as a base for forming a wax material layer 34. Then, the wax materials are screen-printed on the Au plating 32 ((h) wax material paste print process), and then made to reflow so that the Au plating 32 can be coated with the wax materials ((i) wax material reflow process), and the wax material layer 34 is formed. Then, the outer shape of a cover body 3 is punched by press working, and finally anneal/packaging is executed. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004186428(A) 申请公布日期 2004.07.02
申请号 JP20020351560 申请日期 2002.12.03
申请人 CITIZEN WATCH CO LTD;NAU CHEMICAL:KK 发明人 KASAI TAKAO;WAKASUGI MAKOTO;KANESHIRO YOSHIO
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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