发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ELECTROOPTIC DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device by which a thin film transistor can be obtained which is less affected by a coincidence boundary even when the boundary exists in crystal grains of a semiconductor material used in the channel forming region of the transistor. SOLUTION: The thin film transistor T contains a gate electrode 22, a source region 24, a drain region 25, and the channel forming region 26. A silicon film used for forming the channel forming region 26 is composed of nearly single-crystal silicon crystal grains grown from a crystal growth starting point and the lengthwise direction (L direction in the figure) of the region 26 is disposed in a radial direction from the crystal growth starting point. Consequently, the coincidence grain boundary 54 that can be contained in the silicon crystal grains does not traverse the lengthwise direction of the channel forming region 26. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004186206(A) 申请公布日期 2004.07.02
申请号 JP20020348040 申请日期 2002.11.29
申请人 SEIKO EPSON CORP 发明人 HIROSHIMA YASUSHI
分类号 G02F1/1362;G09F9/30;H01L21/20;H01L21/336;H01L29/786;H01L51/50;H05B33/14;(IPC1-7):H01L21/336;G02F1/136 主分类号 G02F1/1362
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