| 发明名称 |
TAPE CARRIER FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THOSE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape carrier for semiconductor device capable of assuring high reliability of adhesion between a semiconductor chip and the tape carrier, and to provide a semionductor apparatus using the same. <P>SOLUTION: The tape carrier comprises a pattern of wiring 2, and an insulating film on which a bump 1 for connecting the semiconductor chip on the wiring pattern is provided. A thermoplastic anisotropic conductive adhesive agent layer 3 including 2 to 5 wt% conductive grain having a grain diameter of 10 to 25% of the diameter of the bump 1 for connecting with the semiconductor chip 9 is formed on the wiring pattern. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004186582(A) |
申请公布日期 |
2004.07.02 |
| 申请号 |
JP20020354133 |
申请日期 |
2002.12.05 |
| 申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
MIYAUCHI KYOKO;TSUNODA YOSHINORI |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
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