发明名称 COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To enhance heat recovery efficiency with cooling water. SOLUTION: This double pipe type cooling system 30 comprises double cooling water pipelines 38 consisting of an inside cooling passage 32 having a plurality of lines arranged in parallel to encircle a peripheral portion of a reaction chamber 12, an outside cooling passage 34 having a plurality of lines arranged in parallel to encircle an outer peripheral portion of the inside cooling passage 32, and a plurality of communication lines 36 for communicating the inside cooling passage 32 with the outside cooling passage 34. The double cooling water pipelines 38 are constructed to supply cooling water to the plurality of lines arranged in parallel for cooling all peripheral portions of a silica bell-jar 20 and a Si wafer 18, therefore enhancing the heat recovery efficiency with the cooling water. A heat insulating material 40 is laid between the inside cooling passage 32 and the outside cooling passage 34 for insulating the heat of the cooling water flowing in the inside cooling passage 32 even when temperature rise occurs therein. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004184027(A) 申请公布日期 2004.07.02
申请号 JP20020354006 申请日期 2002.12.05
申请人 TOKYO ELECTRON LTD;OMI TADAHIRO 发明人 SUENAGA OSAMU;KUREISHI YOSHINORI;OMI TADAHIRO
分类号 F25D1/00;F28D7/10;(IPC1-7):F25D1/00 主分类号 F25D1/00
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