SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem that wiring from a semiconductor to a printed substrate becomes hard when the package of a semiconductor is provided with a multitude of terminals, a plurality of rows and a narrow pitch upon mounting the semiconductor on the printed substrate. SOLUTION: The arrangement of terminals of semiconductor is concentrated to a specified place whereby the wiring from the semiconductor to the printed substrate is facilitated. COPYRIGHT: (C)2004,JPO&NCIPI