发明名称 RESIN SEALING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To obtain resin sealing equipment by which probability of occurrence of a defective product is reduced and the cycle time of manufacture is reduced even in the case of such a product to be sealed as has a cavity on the side of a cope in particular. SOLUTION: The resin sealing equipment 10 is provided with openable and closable drag 14 and cope 16 constituting a die, and supplies the product to be sealed such as a wiring board D and resin material between the drag 14 and the cope 16 to seal a part or the whole of the wiring board D with the resin material. The equipment 10 is provided with a holding mechanism H arranged at the drag 14 and capable of holding the wiring board D, and a supplying mechanism S for supplying the wiring board D to the holding mechanism H arranged at the drag 14. A wiring board pre-heater 46 with a heater (second preheating means )56 is attached to the supplying mechanism S. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004186418(A) 申请公布日期 2004.07.02
申请号 JP20020351462 申请日期 2002.12.03
申请人 SAINEKKUSU:KK 发明人 SAWADA HIROYUKI;YODA OSAMU
分类号 B29C33/12;B29C33/34;B29C45/04;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C33/12
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