发明名称 THIN FILM FORMING METHOD, AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To easily provide a metal thin film of a desired pattern even when the metal thin film is released by using strongly water-repellent releasing agent, and plated thereafter. SOLUTION: A releasing layer 2 is formed by applying releasing agent to the surface of a base film 1, and subjected to corona discharge treatment via an insulating mask 3. Hydrophilicity is given to a predetermined area corresponding to an opening part 3a of the insulating mask 3. Next, the base film 1 is immersed in organic compound solution containing functional groups coordinated in activated catalyst ions. The organic compound is adsorbed by the hydrophilicity-given area to form an organic compound layer 7. Then, the activated catalyst is adsorbed by the organic compound layer 7 to form an activated catalyst layer 8. A plating film 9 is formed on the activated catalyst layer 8 by performing the electroless plating. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004183048(A) 申请公布日期 2004.07.02
申请号 JP20020351728 申请日期 2002.12.03
申请人 MURATA MFG CO LTD 发明人 TAIRA SHINICHI
分类号 C23C18/18;H01G4/12;H01G4/30;(IPC1-7):C23C18/18 主分类号 C23C18/18
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