| 摘要 |
PROBLEM TO BE SOLVED: To provide a safe flow soldering device superior in work efficiency and work stability, with which a solder jet wave tilt and a height are not needed to be adjusted and confirmed by taking much time at the time of soldering a printed board different in thickness. SOLUTION: In the flow soldering device, the printed board 10 is automatically transferred by a transfer heat-proof conveyor 11, it is made to pass on a jet unit and soldering is performed so as to automatically solder an insertion component 52a and the like to the printed board 10. Thickness (t) of the printed board is detected and the heights of jet parts 21 and 22 of the jet unit 20 are adjusted in accordance with thickness (t) of the printed board 10. COPYRIGHT: (C)2004,JPO&NCIPI |
