METHOD AND DEVICE FOR TREATMENT OF PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a treatment method of a printed board which can remove smear generated inside a via hole effectively, realizes easy creeping of plating solution into the via hole and enables effective treatment of the printed board without enlarging the scale of the device. SOLUTION: The method is related to the treatment of a printed board wherein a bump is formed by performing copper plating for a printed board 2 provided with a via hole in a surface thereof. Plasma producing gas is introduced into a chamber 4. Plasma 5 is produced inside the chamber 4 under a pressure close to atmospheric pressure. The bottom surface and a side wall of the via hole are subjected to plasma treatment before copper plating is applied by exposing the printed board 2 in the plasma 5. It is possible to perform desmear treatment for the via hole by plasma treatment and to remove smear produced inside the via hole more effectively than wet-type desmear treatment. COPYRIGHT: (C)2004,JPO&NCIPI