| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated semiconductor device with higher precision by suppressing displacement amount between connection lands, among substrates, when a semiconductor package is laminated. SOLUTION: A plurality of wiring boards 2 provided with a semiconductor element region Ga mounted with a semiconductor chip 10 and an interlayer connection region Gb where a connection land 4 and a through hole 7 are formed, and a plurality of intermediate substrates 13 provided with a bump 8 for aligning with an open part S in which the semiconductor chip can be inserted, are prepared between a base board 14 and a ceiling board 15. In a first process, an adhesive layer is formed on the surface of the intermediate substrate. In a second process, the alignment bump of the intermediate substrate is aligned with the through hole of the wiring board while displacing to the base board, for mutual lamination, and the ceiling board is aligned with the top part for lamination. In a third process, the laminate is thermally press-bonded to thermally cure the adhesive of the adhesive layer, forming a laminated semiconductor device. COPYRIGHT: (C)2004,JPO&NCIPI
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