| 摘要 |
PROBLEM TO BE SOLVED: To provide a management technique for preventing a decrease in yield due to a defect of soldering when a mounted wiring board is manufactured by using a lead-free solder. SOLUTION: This manufacturing method includes a processes for investigating mounted components, investigating printed boards, investigating mass-producing facilities, determining the composition of lead-free solder according to information on them, selecting paste and flux, optimizing process conditions, judging whether or not the process conditions are practical according to the evaluation obtained through the processes; optimizing the temperature profile of soldering, verifying products, examining whether or not a solder defect is caused and judging whether or not the technique is proper as a lead-free technique, verifying mass-productivity, generating and confirming mass-production management standard, and judging whether a mass-production technique has been established in those processes. COPYRIGHT: (C)2004,JPO&NCIPI
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