| 摘要 |
PURPOSE: A method for cleaning and separating a sliced silicon wafer is provided to improve the detergency for the slurry existing on the silicon wafer and considerably reduce cleaning and separating time by using a surfactant. CONSTITUTION: A plurality of sliced silicon wafers are prepared(P). The sliced silicon wafers are attached on a beam. The wafers are cleaned in a cleaning bath by using air bubbles(S1). At this time, the cleaning bath holds a mixed cleaning solution of deionized water and a surfactant. The wafers are separated from the beam by using a separation solution of the deionized water and surfactant(S2). The wafers are then separated from each other by hand in the separation solution(S3).
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