| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP(chemical mechanical polish)-supported liftoff fine patterning which is used for a vacuum-deposited thin film for a micro electronic device and a nano-structure. SOLUTION: The micro electronic device is formed of a first film covering a substrate, a first polishing-resistant layer covering the first film, a second film covering the first polishing-resistant layer, and a junction which is generally vertical between the first and second films and where the first and second polishing-resistant layers contain diamond-like carbons. The first film contains an electrical resistance material, whereas the second film contains a low resistance, conductive material. The first film is an electric resistor realized as a magnetic reading sensor. The electrical resistance material reacts with a magnetic field at high sensitivity. The device includes a generally vertical junction and a dielectric film adjacent to the electrical resistance material. COPYRIGHT: (C)2004,JPO&NCIPI
|
