| 摘要 |
PROBLEM TO BE SOLVED: To provide an outer package member for enclosures of various electronic apparatuses wherein various kinds of diversified characteristics and designs are required whereby outer materials in matching with respective requirements of various apparatuses are quickly developed at a low cost. SOLUTION: Stacked members each comprising a plurality of materials with different characteristics and an area in a prescribed unit are layered, a plurality of the stacked members are fixed by an adhesion process or a thermo compression bonding process to configure a single module, and a plurality of the single modules are fixed by an adhesion process or a thermo compression bonding process to form the outer package member with a required area. COPYRIGHT: (C)2004,JPO&NCIPI
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