METHOD FOR DICING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To suppress chip defects by reducing the stress applied to a semiconductor wafer when dicing. SOLUTION: A dicing line 3 surrounding the periphery of each chip region 2 on the semiconductor wafer 1 by drawing a closed loop is provided. Each chip is individually separated from the semiconductor wafer 1 by dicing the semiconductor wafer along the dicing line 3. COPYRIGHT: (C)2004,JPO&NCIPI