| 摘要 |
PURPOSE: An apparatus for grinding the surface of a silicon wafer is provided to be capable of improving grind efficiency and enhancing surface roughness of the silicon wafer. CONSTITUTION: An apparatus for grinding the surface of a silicon wafer is provided with a wafer chuck for fixing and rotating a silicon wafer, a grinding wheel(20) opposite to the silicon wafer, grinding teeth(T) on the edge portion of the grinding wheel, and a deionized water jet part. The grinding teeth are spaced apart from each other. Each grinding tooth is tilted as much as a predetermined angle(&thgr;) from the corresponding tangent line(Lt) of a periphery(C).
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