| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive without requiring a large amount of labor and cost, capable of suppressing the migration of an electroconductive metal and without giving any damage to a printed circuit substrate. SOLUTION: This electroconductive adhesive contains at least an alicyclic epoxy resin, a bisphenol A type epoxy resin, an epoxy-reactive diluent, an amine-based liquid state curing agent, a triazine-based curing accelerator and an electroconductive filler. COPYRIGHT: (C)2004,JPO&NCIPI
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