| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor chip with which high bonding reliability is obtained, and to provide a highly reliable semiconductor substrate, an electronic device and an electronic apparatus equipped with the device. SOLUTION: The mounting method of the semiconductor chip comprises a low hardness layer forming process [A1] for forming low hardness layers 7 whose hardness is lower than terminals 3 and terminals 6 of a wiring board 4 at an ends of the terminals 3 of the semiconductor chip 1, a filler supply process [A2] for supplying filler 9 comprising conductive particles 91 and having stickiness or adhesiveness between the semiconductor chip 1 and the wiring board 4, a positioning process [A3] for positioning the terminals 3 and the terminals 6 which are to be bonded, so that they are brought into contact with one another through the low hardness layers 7 and the conductive particles 91, and a bonding process [A4] for melting or softening the low hardness layers 7 by heating and bonding the corresponding terminals 3 and 6. It is desirable that the hardness of the low hardness layers 7 is lower than that of the conductive particles 91. COPYRIGHT: (C)2004,JPO&NCIPI
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