| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting device for a semiconductor substrate and a cutting method with reduced occurrence of cracks, fractures, etc. at the time of cutting the semiconductor substrate. <P>SOLUTION: The cutting device for a semiconductor substrate is provided with a cutting means for cutting a semiconductor substrate 1, supporting boards 5 and 6 for supporting the semiconductor substrate 1, and fixing means 7 and 8 fixing both sides of a region to be the cutting line of the semiconductor substrate 1. The above fixing means 7 and 8 include workpiece holders 7 and 8 in the region at least on one side to the cutting line, and include a pinching means fixing the semiconductor substrate 1 in such a manner as to sandwich it between the supporting boards 5 and 6 and the workpiece holders 7 and 8. Preferably, the above cutting means has an irradiating function of a laser beam 20. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
