发明名称 CURING METHOD FOR EPOXY RESIN SYSTEM DOUBLE-FLUID TYPE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a curing method for an epoxy resin system double-fluid type adhesive satisfying requirements such as an improvement in construction result, the stability of work, an improvement in work efficiency, the free suspension of work, power saving, the reduction of cost, and the simplification of work preparations and tidying. SOLUTION: In construction work for supplying the epoxy resin system double-fluid adhesive composed of a main agent 1 and a curing agent 2 to a construction part 5 of a concrete structure 4 and curing the same, an adhesive supply means 11 including a main agent supply system 21, a curing agent supply system 31 and a mixing supply system 41 is used to feed the main agent 1 and the curing agent 2 from the main agent supply system 21 and the curing agent supply system 31 to the mixing supply system 41 to obtain an uncured mixed adhesive 3 which is supplied from the tip of the mixing supply system 41 to the construction part 5 of the concrete structure 4. The uncured adhesive 3 is cured in the construction part 5. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004183334(A) 申请公布日期 2004.07.02
申请号 JP20020351886 申请日期 2002.12.04
申请人 JDC CORP 发明人 ASAKURA TAKEO;KUDO KENGO;SATO JUNICHI;ONO MUTSUHIRO
分类号 E04G23/02;C09J5/00;C09J163/00;(IPC1-7):E04G23/02 主分类号 E04G23/02
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