发明名称 RESIN APPLYING METHOD OF PANEL, A FABRICATION METHOD OF A DISPLAY PANEL AND A RESIN APPLYING DEVICE, ESPECIALLY REGARDING TO A METHOD OF APPLYING RESINS TO A SUBSTRATE CONNECTOR OF A PANEL TO REINFORCE A CONNECTION SUBSTRATE CONNECTED TO A DISPLAY PANEL
摘要 PURPOSE: A resin applying method of a panel, a fabrication method of a display panel and a resin applying device are provided to supply resins between an edge portion of a lower substrate and a lower side of a connection substrate without reversing a display panel such as a liquid crystal cell. CONSTITUTION: Dispensers(20,40) have syringes(21,41) to which melted resins are introduced, and needle-shaped nozzles(22,42) for supplying the resins toward a liquid crystal cell(1) from the syringes(21,41). Resin solution tanks(23,43) are installed to supply the resins to the syringes(21,41). Pipes(24,44) are connected between the resin solution tanks(23,43) and the syringes(21,41). Control valves(25,45) are installed in the middle of the pipes(24,44), while liquid level sensors(32,56) are mounted on the syringes(21,41).
申请公布号 KR20040057876(A) 申请公布日期 2004.07.02
申请号 KR20030033529 申请日期 2003.05.27
申请人 HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD. 发明人 WADA KENYA;ONOSHIRO JUN;HIRASEKO KOUJI
分类号 B05C5/02;B05C11/10;B05D1/26;B05D7/00;G02F1/13;G02F1/1345;G09F9/00;H05K3/28;H05K3/30;H05K3/36;(IPC1-7):G02F1/13 主分类号 B05C5/02
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