发明名称 HOT STAMPING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To optimize an on-demand issue of a value-added medium. <P>SOLUTION: In a hot stamping apparatus 1, a hot stamping foil and the value-added medium are placed between a stamp head 3 heated by a heater 2 and a receptacle table 4, and transferring is performed while a pressure is applied. The stamp head 3 is formed of tungsten, a tungsten alloy or a cubic crystal system boron nitride. The heater 2 has a base part 5 and a heating part 6, and the base part 5 is formed of an aluminum nitride material with a linear expansion coefficient and a heat conductivity which are the same as or similar to those of tungsten or the tungsten alloy, and the heating part 6 is formed of tungsten or the tungsten alloy. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004181932(A) 申请公布日期 2004.07.02
申请号 JP20030153414 申请日期 2003.05.29
申请人 SANKYO SEIKI MFG CO LTD 发明人 YOKOZAWA MITSUO;IIZAWA MOTOHIRO;KUROIWA YUKIO;TAKAZAWA KIYOTSUGU
分类号 B41F16/00;B41M5/00 主分类号 B41F16/00
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