APPARATUS FOR FORMING STACK TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus for forming a stack type semiconductor package is provided to secure smooth motion of a press block by restraining predetermined gas having high viscosity from flowing into the lower portion of the press block using a gasket. CONSTITUTION: An apparatus for forming a stack type semiconductor package is provided with a support plate(110) having a plurality of through holes and a plurality of press blocks(106) corresponding to the through holes for loading stack type semiconductor packages(104). Each press block is capable of moving up and down along the through hole. The apparatus further includes a gasket(108) for completely covering the support plate except the press blocks. A fixing pin is connected with the lower portion of each press block.