AUTO MOLDING APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An auto molding apparatus for manufacturing a semiconductor package is provided to improve working efficiency and reduce fabrication time by improving the loading manner of an upper and lower mold and forming a shutter type door on a plunger unit cover. CONSTITUTION: An auto molding apparatus(200) for manufacturing a semiconductor package is provided with a mold unit(210) for loading an upper and lower mold(212,214), and a plunger unit(230) having a plunger connected with one out of the molds for carrying out a rising and falling process. The upper and the lower mold are loaded in the mold unit by using a sliding insertion manner. A plunger unit cover(232) is installed on the front portion of the plunger unit for protecting the plunger unit. A shutter typed door(234) is formed on the plunger unit cover corresponding to the plunger.