| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a working simulation system of a grinding device and its simulation method for grinding a work such as a glass of optical components or a semiconductor silicon wafer with the super-precision, wherein an optimum working condition of the work does not depend on a skilled level of an operator and the number of works to be ground is reduced to easily obtain in a short time. <P>SOLUTION: Parametersα, n for obtaining the quantity of grinding a work 42 are acquired by an arithmetic process in accordance with two actual working data of a temporal change of a grinding resistance and a relationship between a cutting speed and the grinding resistance. The work 42 is divided into cells 95, so that the quantity of grinding of only the cell 95 coming into contact with grinding operation planes 34a, 34b is acquired by an arithmetic means, and a condition of the grinding working plane of the work 42 is simulated from the quantity of grinding. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
