| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive material constituting a semiconductor element, an ink composition containing the conductive material, a bump-forming method as well as a bump itself constituting the semiconductor element, well satisfying expected functions, of a small diameter which has not been able to be realized before, and with work hours drastically reduced. <P>SOLUTION: The manufacturing method of the conductive material is to make a conductive material dissolved in supercritical fluid or subcritical fluid and to have its crystals precipitated. As compared with the conventional bump-forming method, bumps can be formed simply and quickly at low cost, realizing a bump-forming method with working hours drastically shortened in a bump-forming process. Further, by forming a conductive adhesive layer 44 in place of an intermediate metal layer by an ink-jet method, complicated processes of the past for making the intermediate metal layer and a solvent treatment process are done away with. Furthermore, an ink composition for soldering alloy forming excellent in discharging, patterning, and film-forming properties as well as an ink composition for flux forming and an ink composition for a conductive adhesive layer forming can be obtained by the use of a supercritical fluid or a subcritical fluid process. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
