MANIPULATION OF MICROMETER-SIZED ELECTRONIC OBJECTS WITH LIQUID DROPLETS
摘要
A system for manipulating a small object (3) comprising a substrate to receive the small object (3), a liquid droplet (4), which carries the small object (3) on the substrate, and a pre-treated surface structure of the substrate in the vicinity (1,2) of the placement position (1) of the small object (3). The small objects (3) like silicon dies in the range from 100 down to 1 micrometer are fine-placed by an evaporating droplet (4). The dies will serve as active electronic elements in large-area displays and other applications.
申请公布号
WO2004055887(A2)
申请公布日期
2004.07.01
申请号
WO2003IB05273
申请日期
2003.11.17
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.;DUINEVELD, PAULUS, C.;PRINS, MENNO, W., J.;DECRE, MICHEL, M., J.
发明人
DUINEVELD, PAULUS, C.;PRINS, MENNO, W., J.;DECRE, MICHEL, M., J.