发明名称 |
CURE APPARATUS WITH MAGAZINE |
摘要 |
PURPOSE: A cure apparatus with a magazine is provided to shorten an interval of process time by making a plurality of die attach apparatuses in-line with a hardening apparatus such that the plurality of die attach apparatuses are individually installed in a die attach process and a hardening process. CONSTITUTION: The inner space of a chamber(11) is isolated from the outside. An inlet/outlet for a chip mounting frame is formed in the chamber. A heater assembly(31) increases a temperature, installed inside the chamber. A fan circulates air, installed inside the chamber. A fan driving unit(51) drives the fan. A plurality of slots(23) into which the chip mounting frame is inserted are vertically disposed in the magazine(21). A magazine elevating unit(41) vertically transfers the position of the magazine.
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申请公布号 |
KR20040056687(A) |
申请公布日期 |
2004.07.01 |
申请号 |
KR20020083228 |
申请日期 |
2002.12.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG, SEONG BOK;KANG, GIL MAN;KIM, YUN SU;KWON, YEONG HAN |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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